Plating bath composition for electroless plating of metals and metal alloys

摘要

The present invention relates to an additive that can be used in an electroless metal and a metal alloy plating bath, and a method of using the plating bath. Such additives are those that reduce the plating rate and increase the stability of the electroless plating bath, and therefore such electroless plating baths are suitable for trenches and printed circuit boards, IC substrates, and semiconductor substrates. It is particularly suitable for depositing the metal or metal alloy in a concave structure such as a via. This electroless plating bath is also useful for metallization for display applications.