PROBLEM TO BE SOLVED: To provide a technique of reducing the packaging area of a place at which a construction of interrupting a propagation path of high frequency signals is packaged in electronic apparatus having a shield cover while the propagation path of the high frequency signals is interrupted at any place of the shield cover.SOLUTION: A shield cover 100 of an electronic apparatus is assembled to a wiring board 300. Insertion holes are formed at any position of the shield cover 100. A clip 20 which receives a fixing pin 500 inserted in the shield cover 100 and conducts the fixing pin 500 and the ground of a wiring board 300 is assembled at each position corresponding to the insertion hole of the shield cover 100. The fixing pin 500 is inserted in each insertion hole so that the shield cover 100 and the head apex portion of the fixing pin 500 come into contact with each other, and the fixing pin 500 is caught by the clip 20, whereby the shield cover 100 and the ground of the wiring board 300 are conducted to each other.
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