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Silicon compound-coated metal fine particles, composition containing silicon compound-coated metal fine particles, and method for producing silicon compound-coated metal fine particles

机译:涂覆有硅化合物的金属细颗粒,包含涂覆有硅化合物的金属细颗粒的组合物以及生产涂覆有硅化合物的金属细颗粒的方法

摘要

The present invention is a silicon compound-coated metal fine particle in which at least a part of the surface of a metal fine particle comprising at least one metal element or metalloid element is coated with a silicon compound, and Si— contained in the silicon compound-coated metal fine particle The present invention relates to silicon compound-coated metal fine particles, wherein the OH bond ratio is controlled to be 0.1% or more and 70% or less. According to the present invention, silicon compound-coated metal fine particles whose properties such as dispersibility are controlled by controlling the ratio of Si-OH bonds or the ratio of Si-OH bonds / Si-O bonds contained in the silicon compound-coated metal fine particles. Can provide. By controlling the Si—OH bond ratio or the Si—OH bond / Si—O bond ratio, the silicon compound-coated metal fine particles can be used more diversely and have the desired characteristics than the conventional ones. The exact composition can be easily designed.
机译:本发明是涂覆有硅化合物的金属微粒,其中包含至少一种金属元素或准金属元素的金属微粒的表面的至少一部分涂覆有硅化合物,并且该硅化合物中包含Si-包覆有硅化合物的金属微粒本发明涉及一种包覆有硅化合物的金属微粒,其中将OH键比率控制为0.1%以上且70%以下。根据本发明,通过控制包含在涂有硅化合物的金属中的Si-OH键的比例或Si-OH键/ Si-O键的比例来控制其性质如分散性的涂有硅化合物的金属微粒。细颗粒。可以提供。通过控制Si-OH键比例或Si-OH键/ Si-O键比例,与常规方法相比,涂覆有硅化合物的金属微粒可以更多样化地使用并且具有期望的特性。确切的组成可以很容易地设计。

著录项

  • 公开/公告号JPWO2017209256A1

    专利类型

  • 公开/公告日2018-06-14

    原文格式PDF

  • 申请/专利权人 エム・テクニック株式会社;

    申请/专利号JP20170533983

  • 发明设计人 榎村 眞一;本田 大介;

    申请日2017-06-01

  • 分类号B22F1/02;C01B33/12;B22F9/24;B22F1;

  • 国家 JP

  • 入库时间 2022-08-21 13:07:06

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