The objective of the present invention is to provide: a polyvalent phenylene ether novolac resin that provides a cured product having high heat resistance and superior dielectric properties; and an epoxy resin composition containing same. In the polyvalent phenylene ether novolac resin, a poly(phenylene ether) resin having a molecular weight of 400-8000 (weight average molecular weight; in terms of polystyrene) is bonded by means of an organic group.
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