It is an object to provide a conductive copper paste that can be cured in an air atmosphere, has a long pot life, has a low specific resistance even under high-temperature and short-time curing conditions, and does not significantly change the specific resistance after curing depending on the content of copper powder. And A conductive copper paste characterized by containing (A) copper powder, (B) a thermosetting resin, (C) a fatty acid that is liquid at normal temperature, and (D) triethanolamine. The component (B) is preferably a resol type phenol resin, and the component (B) is more preferably 10 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (B). .
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