首页> 外国专利> Thermal oxide equivalent low temperature ALD oxide for dual purpose gate oxide and method for producing the same

Thermal oxide equivalent low temperature ALD oxide for dual purpose gate oxide and method for producing the same

机译:用于两用栅氧化物的热氧化物当量低温ALD氧化物及其制备方法

摘要

Methods of forming conformal low temperature gate oxides on a HV I/O and a core logic and the resulting devices are provided. Embodiments include providing a HV I/O and core logic laterally separated on a Si substrate, each having a fin; forming a gate oxide layer over each fin and the Si substrate; forming a silicon oxy-nitride layer over the gate oxide layer; forming a sacrificial oxide layer over the silicon oxy-nitride layer; removing the sacrificial oxide and silicon oxy-nitride layers and thinning the gate oxide layer; forming a second gate oxide layer over the thinned gate oxide layer; forming a silicon oxy-nitride layer over the second gate oxide layer; removing the silicon oxy-nitride and second gate oxide layers over the core logic fin portion; forming an IL over the core logic fin portion; and forming a HfOx layer over the second silicon oxy-nitride layer and ILs.
机译:提供了在HV I / O和核心逻辑上形成保形的低温栅极氧化物的方法以及所得的器件。实施例包括在每个具有鳍的Si衬底上横向分离地提供HV I / O和核心逻辑。在每个鳍和硅衬底上形成栅氧化层;在栅氧化层上形成氮氧化硅层;在氮氧化硅层上形成牺牲氧化物层;去除牺牲氧化物和氮氧化硅层并减薄栅氧化物层;在减薄的栅极氧化物层上方形成第二栅极氧化物层;在第二栅极氧化物层上方形成氮氧化硅层;去除核心逻辑鳍片部分上方的氮氧化硅和第二栅极氧化物层;在核心逻辑鳍片部分上形成IL;并在第二氮氧化硅层和IL上形成HfO x 层。

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