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Circuit board and smart card module and smart card utilizing the same

机译:电路板和智能卡模块以及使用该电路板的智能卡

摘要

A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region provided on the substrate. The pad region is configured for mounting an electronic component, and comprises a plurality of pads spaced from each other and traces connected to their respective pads. At least one of the pads has an arc edge. In the present invention, the distance between the pads is easy to be controlled during fabrication, and the stability of the adhesion between the chip and pad region is enhanced.
机译:提供了一种电路板以及使用该电路板的智能卡模块和智能卡。电路板包括基板和设置在基板上的焊盘区域。焊盘区域被配置用于安装电子部件,并且包括彼此间隔开的多个焊盘以及连接到它们各自的焊盘的迹线。至少一个垫具有弧形边缘。在本发明中,在制造期间容易控制焊盘之间的距离,并且增强了芯片和焊盘区域之间的粘附的稳定性。

著录项

  • 公开/公告号US10032708B2

    专利类型

  • 公开/公告日2018-07-24

    原文格式PDF

  • 申请/专利权人 JOHNSON ELECTRIC S.A.;

    申请/专利号US201715422758

  • 发明设计人 DOMINIC JOHN WARD;RONG ZHANG;YI QI ZHANG;

    申请日2017-02-02

  • 分类号H01L23/498;G06K19/077;H01L23/544;H01L23;

  • 国家 US

  • 入库时间 2022-08-21 13:04:55

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