首页> 外国专利> POLYAMIDE RESIN COMPOSITION HAVING THERMAL AGING RESISTANCE AND METHOD FOR ENHANCING THERMAL AGING RESISTANCE OF POLYAMIDE RESIN

POLYAMIDE RESIN COMPOSITION HAVING THERMAL AGING RESISTANCE AND METHOD FOR ENHANCING THERMAL AGING RESISTANCE OF POLYAMIDE RESIN

机译:具有耐热老化性的聚酰胺树脂组合物和增强聚酰胺树脂的耐热老化性的方法

摘要

The present invention is a polyamide resin composition having a thermal aging resistance in a level which is resistant to a high-temperature and long-term environment of 200° C. and longer than 1000 hours. According to the present invention, there is provided a polyamide resin composition containing a polyamide resin (A) and another polyamide resin (B) which exhibits lower oxygen permeability than the polyamide resin (A), wherein a ratio by mass (A)/(B) of the polyamide resin (A) to the polyamide resin (B) is from 98/2 to 60/40, and wherein, to 100 parts by mass of the total amount of the polyamide resin (A) and the polyamide resin (B), 0.5 to 20 part (s) by mass of a metal cyanide salt of a composition formula (1) is compounded.
机译:本发明是具有耐高温老化性的聚酰胺树脂组合物,该水平的耐高温和长期环境为200℃且超过1000小时。根据本发明,提供了一种聚酰胺树脂组合物,其包含聚酰胺树脂(A)和另一种聚酰胺树脂(B),该聚酰胺树脂显示出比聚酰胺树脂(A)低的透氧性,其中质量比(A)/(聚酰胺树脂(A)相对于聚酰胺树脂(B)的B)为98/2〜60/40,其中,相对于聚酰胺树脂(A)和聚酰胺树脂的合计量为100质量份(A)。 B)中,配合0.5〜20质量份组成式(1)的金属氰化物盐。

著录项

  • 公开/公告号US2018194942A1

    专利类型

  • 公开/公告日2018-07-12

    原文格式PDF

  • 申请/专利权人 TOYOBO CO. LTD.;

    申请/专利号US201615742170

  • 发明设计人 NOBUHIRO YOSHIMURA;

    申请日2016-07-22

  • 分类号C08L77;C08K3/08;C08K3/28;C01C3/12;

  • 国家 US

  • 入库时间 2022-08-21 13:01:59

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