首页>
外国专利>
METHOD OF MEASURING AN ADHESIVE FORCE OF INTERLAYER ADHESIVE LAYER IN TENSILE MODE FOR STACKED SEMICONDUCTOR DEVICE AND APPARATUS FOR MEASURING THE SAME
METHOD OF MEASURING AN ADHESIVE FORCE OF INTERLAYER ADHESIVE LAYER IN TENSILE MODE FOR STACKED SEMICONDUCTOR DEVICE AND APPARATUS FOR MEASURING THE SAME
展开▼
机译:叠层半导体器件拉伸模式下层间粘合层粘合力的测量方法及其测量装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method includes providing a device under test, which includes a lower test layer and an upper test layer that is stacked on the lower test layer and includes an overhang protruding past an edge of the lower test layer by a predetermined length, fixing the lower test layer onto a mounting stage, and measuring adhesive force of an interlayer adhesive layer in a tensile mode by applying a load to a bottom surface of the overhang of the upper test layer in a first direction. An apparatus includes a mounting stage fixing the device under test, a load applying tip applying the load to the bottom surface of the overhang, a location adjuster adjusting a distance between the device under test and the load carrying tip, a load cell detecting a magnitude of the applied load, and a controller controlling the location adjuster and the load cell.
展开▼