INTERNAL CRACK DETECTING METHOD AND INTERNAL CRACK DETECTING APPARATUS
展开▼
机译:内部裂纹检测方法和内部裂纹检测装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for detecting an internal crack in a wafer includes a first image recording step of applying near infrared light having a transmission wavelength to a reference wafer having the same configuration as a target wafer to be subjected to the detection of the internal crack, thereby obtaining a first image of the reference wafer having no internal crack and then recording the first image, a processing step of processing the target wafer, a second image recording step of applying the near infrared light to the target wafer, thereby obtaining a second image of the processed target wafer and then recording the second image, and an internal crack detecting step of removing the same image information between the first image and the second image from the second image to obtain a residual image, thereby detecting the residual image as the internal crack in the target wafer.
展开▼