首页> 外国专利> WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYER

WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYER

机译:化学镀锡膜表面的洗涤溶液,所述洗涤溶液的补足溶液和形成镀锡层的方法

摘要

The invention relates to a washing solution for a tin plating film after electroless tin plating and before water washing. The invention also relates to a method for forming a tin plating film, the method includes a step of washing step using the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution has a chloride ion concentration of 2 wt % or more, and a tin concentration of 0.5 wt % or less. The washing solution according to the present invention has good washing property for a tin plating film surface, and allows a tin plating film to easily maintain its properties. In addition the washing solution causes little influence on a tin plating film surface even when continuously used and is excellent in temporal stability.
机译:本发明涉及一种化学镀锡之后且水洗之前的镀锡膜清洗液。本发明还涉及形成镀锡膜的方法,该方法包括使用清洗液的清洗步骤。根据本发明的洗涤溶液是包含酸,络合剂,稳定剂和氯离子的酸性水溶液。清洗液的氯离子浓度为2重量%以上,锡浓度为0.5重量%以下。根据本发明的清洗液对镀锡膜表面具有良好的清洗性能,并使镀锡膜容易保持其性能。另外,即使连续使用,清洗液对镀锡膜表面的影响也很小,并且在时间稳定性方面优异。

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