首页> 外国专利> Adjustment apparatus for adjusting processing units provided in a substrate processing apparatus, and a substrate processing apparatus having such an adjustment apparatus

Adjustment apparatus for adjusting processing units provided in a substrate processing apparatus, and a substrate processing apparatus having such an adjustment apparatus

机译:用于调整设置在基板处理设备中的处理单元的调整设备以及具有这种调整设备的基板处理设备

摘要

An adjustment apparatus capable of adjusting various types of processing units of a substrate processing apparatus within a shorter period of time is disclosed. The adjustment apparatus includes a main operation device configured to manipulate the processing units and adjust the designated operations, terminal operation devices configured to manipulate the processing units and adjust the designated operations, a network that connects the processing units and the main operation device to each other; and connecting devices configured to connect the terminal operation devices to the network and disconnect the terminal operation devices from the network. Each of the terminal operation devices is configured to be able to manipulate at least one of the processing units.
机译:公开了一种能够在更短的时间内调节基板处理设备的各种类型的处理单元的调节设备。调整装置包括:主操作装置,其被配置为操作处理单元并调整指定的操作;终端操作装置,其被配置为操作处理单元并调整指定的操作;将处理单元和主操作装置彼此连接的网络。 ;连接设备,用于将终端操作设备连接到网络,并从网络断开终端操作设备。每个终端操作设备被配置为能够操纵处理单元中的至少一个。

著录项

  • 公开/公告号US9915938B2

    专利类型

  • 公开/公告日2018-03-13

    原文格式PDF

  • 申请/专利权人 EBARA CORPORATION;

    申请/专利号US201514596531

  • 发明设计人 KOICHI TAKEDA;TAKAMASA NAKAMURA;

    申请日2015-01-14

  • 分类号G06F19;G05B19/418;

  • 国家 US

  • 入库时间 2022-08-21 12:59:04

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