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Hot plate with programmable array of lift devices for multi-bake process optimization

机译:带有升降装置的可编程阵列的热板,用于多烘烤工艺优化

摘要

Embodiments of systems and methods for substrate thermal processing using a hot plate with a programmable array of lift devices for multi-bake process optimization are presented. In an embodiment, an apparatus includes a base with an upper surface configured to receive the substrate. The base may include at least one heater for heating the substrate while on or in the vicinity of the base, and a plurality of lift devices configured to selectively extend from the upper surface of the base to support the substrate above the base when extended, and allow the substrate to rest on the upper surface of the base when retracted, each lift device being actuated independently of the other lift devices by an actuating mechanism. Additionally, the apparatus may include a controller for controlling the plurality of actuating mechanisms.
机译:提出了使用具有用于多个烘烤工艺优化的升降装置的可编程阵列的热板进行基板热处理的系统和方法的实施例。在一个实施例中,一种设备包括具有上表面的基座,该上表面被配置为接收基板。基座可以包括至少一个加热器,该加热器用于在基座上或基座附近时加热基板;以及多个提升装置,其构造成从基座的上表面选择性地延伸,以在延伸时将基板支撑在基座上方。允许基板在缩回时搁置在基座的上表面上,每个升降装置均通过致动机构独立于其他升降装置进行致动。另外,该设备可以包括用于控制多个致动机构的控制器。

著录项

  • 公开/公告号US9978618B2

    专利类型

  • 公开/公告日2018-05-22

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号US201615287877

  • 发明设计人 JOSH HOOGE;MARK SOMERVELL;MICHAEL CARCASI;

    申请日2016-10-07

  • 分类号H01L21/00;H01L21/67;H01L21/68;H01L21/687;H01L21/027;

  • 国家 US

  • 入库时间 2022-08-21 12:58:03

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