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Method for reducing temperature transition in an electrostatic chuck

机译:减少静电卡盘中温度转变的方法

摘要

A method for controlling a substrate temperature in a substrate processing system includes determining a temperature difference between the substrate temperature before the substrate is loaded onto a substrate support device and a desired temperature for the substrate support device and, during a first period, controlling a thermal control element to adjust the temperature of the substrate support device to a temperature value based on the temperature difference. The temperature value is not equal to the desired temperature for the substrate support device. The method further includes loading the substrate onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature and, during a second period that follows the first period, controlling the temperature of the substrate support device to the desired temperature for the substrate support device.
机译:一种用于在基板处理系统中控制基板温度的方法,该方法包括确定在将基板装载到基板支撑装置上之前的基板温度与该基板支撑装置的期望温度之间的温度差,并且在第一时间段期间,控制热控制元件,用于根据温度差将基板支撑装置的温度调节至温度值。温度值不等于基板支撑装置的期望温度。该方法还包括在第一时段开始之后并且在基板支撑装置的温度返回到期望温度之前,以及在第一期间之后的第二时段期间,将基板加载到基板支撑装置上,以控制基板支撑件的温度。装置达到衬底支撑装置所需的温度。

著录项

  • 公开/公告号US9922855B2

    专利类型

  • 公开/公告日2018-03-20

    原文格式PDF

  • 申请/专利权人 LAM RESEARCH CORPORATION;

    申请/专利号US201715692002

  • 发明设计人 TAO ZHANG;OLE WALDMANN;ERIC A. PAPE;

    申请日2017-08-31

  • 分类号H01L21/00;H01L21/683;H01L21/66;H01L21/67;G05D23/19;

  • 国家 US

  • 入库时间 2022-08-21 12:57:35

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