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System for refurbishing or remanufacturing an electronic device

机译:翻新或重新制造电子设备的系统

摘要

An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.
机译:翻新或重新制造电子设备的方法可包括暴露位于电子设备内部的电子组件。该方法还可以包括用一个或多个替换组件替换电子设备的一个或多个有缺陷的电子组件,以及在电子设备的内部的至少一部分上施加保护涂层。该保护涂层可以覆盖电路板及其所携带的电子组件。保护涂层还可以覆盖电子设备的至少一些电连接。保护涂层也可以在重新组装之前被施加到替换部件上。因此,可以为所得的翻新或再制造的电子设备提供耐湿性,以帮助保护电子设备免受因暴露于湿气而引起的损坏。

著录项

  • 公开/公告号US9894776B2

    专利类型

  • 公开/公告日2018-02-13

    原文格式PDF

  • 申请/专利权人 HZO INC.;

    申请/专利号US201414157780

  • 申请日2014-01-17

  • 分类号H05K3/30;H05K13/04;H05K3/22;H05K3/28;

  • 国家 US

  • 入库时间 2022-08-21 12:57:18

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