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Power field-effect transistor (FET), pre-driver, controller, and sense resistor integration for multi-phase power applications
Power field-effect transistor (FET), pre-driver, controller, and sense resistor integration for multi-phase power applications
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机译:功率场效应晶体管(FET),预驱动器,控制器和感测电阻器集成,用于多相电源应用
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摘要
Techniques are described for integrating power field-effect transistors (FETs), pre-drivers, controllers, and/or resistors into a common multi-chip package for implementing multi-phase bridge circuits. The techniques may provide a multi-chip package with at least two high-side (HS) FETs and at least two low-side (LS) FETs, and place the at least two HS FETs or the at least LS FETs on a common die. Placing at least two FETs on a common die may reduce the number of die and the number of thermal pads (i.e., die pads) needed to implement a set of power FETs, thereby decreasing component count of a multi-phase bridge circuit and/or allowing a more compact, higher current density multi-phase bridge circuit to be obtained without significantly increasing thermal power dissipation of the circuit.
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