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Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof
Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof
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机译:具有低介电常数的多层聚酰亚胺膜,包括其的层压结构及其制造
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摘要
A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.
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