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Chip alignment utilizing superomniphobic surface treatment of silicon die
Chip alignment utilizing superomniphobic surface treatment of silicon die
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机译:利用硅芯片的超疏水表面处理进行芯片对准
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摘要
Certain embodiments of the present disclosure provide a method for soldering a chip onto a surface. The method generally includes forming a bonding pad on the surface on which the chip is to be soldered, wherein the bonding pad is surrounded, at least in part, by dielectric material. The method may also include treating the dielectric material to render the dielectric material superomniphobic, and soldering the chip onto the bonding pad.
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