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The cleaning compound mold and methods for cleaning mold semiconductor packaging
The cleaning compound mold and methods for cleaning mold semiconductor packaging
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机译:清洁化合物模具和清洁模具半导体封装的方法
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摘要
Provided are: a mold cleaning compound, which is a compound for cleaning a semiconductor packaging mold and has a spheroidal or cylindrical shape; and a mold cleaning method using the same.
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