high cure and high thixotropy epoxy based adhesive compositions

摘要

The present disclosure relates to a precursor composition for a curable adhesive, the precursor composition comprising: a) a part (a) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mol of amine equivalents; ii. a second epoxy curing agent other than the first epoxy curing agent; iii. a metal nitrate catalyst; iv. optionally a metal triflate catalyst; and b) a part (b) comprising: i. an epoxy resin; ii. a filler material; iii. an epoxy reactive diluent; and iv. optionally a core-wrap polymer-based quenching agent; and wherein the amount of filler is selected to provide part (b) with a hysteresis area of at least 30 pa x 1 / s when measured at 23 ° c according to the test method described. in the experimental section. The compositions of the present disclosure are particularly suitable for use in structural bonding applications, in particular for adhesive bonding of small parts in manufacturing operations in the aeronautical and aerospace industries. The present disclosure also relates to a method of using such curable epoxy resin compositions.