silica microspheres, bonding process and possible uses of silica microspheres

摘要

silica microspheres, bonding process and possible uses of silica microspheres. The present invention relates to silica microspheres having an outer diameter 5 of 50 to 125 µm, preferably 60 to 90 µm, a wall thickness greater than 1 to 3 µm. m and a density between 0,3 and 0,7 g / cm ^ 3 ^, process for the injection process of silica microsphere precursors (ms, pr1, pr1 39, pr2 39) in the middle of a plasma (p), bonding processes and possible uses of silica microspheres.