LOW COST MANUFACTURING OF MICRO-CHANNEL HEATSINK

摘要

A cooling device (10) includes a ceramic substrate (16) with a metal layer(22)bonded to an outer planar surface (18). The cooling device (10) also includesachannel layer (24) bonded to an opposite side of the ceramic substrate (16)and amanifold layer (26) bonded to an outer surface (28) of the channel layer (24).Thesubstrate layers (16), (22), (24), (26) are bonded together using a hightemperatureprocess such as brazing to form a single substrate assembly (14). A plenumhousing(30) is bonded to the single substrate assembly (14) via a low temperaturebondingprocess such as adhesive bonding and is configured to provide extendedmanifoldlayer inlet and outlet ports (32), (34).