首页> 外国专利> HIGH TEMPERATURE-RESISTANT LIGHT-WEIGHT THERMAL-INSULATING MATERIAL HAVING DUEL POROUS STRUCTURE AND PREPARATION METHOD THEREFOR

HIGH TEMPERATURE-RESISTANT LIGHT-WEIGHT THERMAL-INSULATING MATERIAL HAVING DUEL POROUS STRUCTURE AND PREPARATION METHOD THEREFOR

机译:具有多孔结构的耐高温轻质隔热材料及其制备方法

摘要

A high temperature-resistant light-weight thermal-insulating material having a duel porous structure and a preparation method therefor. In said material, alumina, silica and aluminosilicate powder are used as raw materials, a molding auxiliary and a pore-forming agent are added, after stirring well and then extrusion molding, obtained by means of firing is a high temperature-resistant light-weight thermal-insulating material which has a dual porous structure of macroscopic through-holes and micro-pores, wherein a ratio of a total volume of the through-holes to a total volume of the micro-pores is 0.5-25: 1.
机译:具有双重多孔结构的耐高温轻质隔热材料及其制备方法。在所述材料中,以氧化铝,二氧化硅和铝硅酸盐粉末为原料,在充分搅拌后加入成型助剂和成孔剂,然后通过挤出成型,通过煅烧得到耐高温轻质材料。具有宏观通孔和微孔的双重多孔结构的绝热材料,其中通孔的总体积与微孔的总体积之比为0.5-25∶1。

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