ACCELERATING THE BREAKUP OF FLUID BRIDGES FOR MICRO-DISPENSING APPLICATIONS

摘要

Conductive viscoelastic adhesives are often used to bond silicon dies and printed circuit boards (PCB) together. The deposit of these adhesives on substrates through nozzles may lead to liquid bridges whose breakup causes stringing and the generation of satellite droplets resulting in the contamination of the adjacent droplets. Also the time to break up the bridges may be excessive. In order to overcome these problems the nozzle is rotated and the aspect ratio of the bridges is kept small.