MICRO DEVICE TRANSFERRING METHOD, AND MICRO DEVICE SUBSTRATE MANUFACTURED BY MICRO DEVICE TRANSFERRING METHOD

摘要

The present invention relates to a method for transferring a micro device, comprising: a pressurization step; a first adhesive force forming step; a second adhesive force forming step; and a releasing step. The pressurization step enables a carrier film, in which the micro device is attached to an adhesive layer, and a substrate, on which a solder is applied onto a metal electrode, to contact each other and pressurize the same. In the first adhesive force forming step, a first adhesive force between the micro device and the solder is formed as the solder disposed between the micro device and the metal electrode is pressed by the pressurization step. In the second adhesive force forming step, a second adhesive force between the micro device and the adhesive layer is formed as the micro device is press-fitted into and bonded to the adhesive layer by the pressurization step. The releasing step releases the carrier film from the substrate, with the micro device adhered to the solder. The strength of the second adhesive force is proportional to a press-fitting depth at which the micro device is press-fitted into the adhesive layer, and the press-fitting depth of the micro device with respect to the adhesive layer is formed within a range in which the second adhesive force is formed to be smaller than the first adhesive force.