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CONDUCTIVE PASTE, CONDUCTIVE FILM, METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE THIN WIRING LINE AND METHOD FOR PRODUCING CONDUCTIVE THIN WIRING LINE
CONDUCTIVE PASTE, CONDUCTIVE FILM, METHOD FOR PRODUCING CONDUCTIVE FILM, CONDUCTIVE THIN WIRING LINE AND METHOD FOR PRODUCING CONDUCTIVE THIN WIRING LINE
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机译:导电性糊剂,导电性薄膜,导电性薄膜的制造方法,导电性细布线线以及导电性细布线线的制造方法
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摘要
[Problem] To provide a conductive paste which enables the achievement of a conductive film that has excellent laser etching properties and is useful for the formation of a thin wiring line.[Solution] After mixing and dispersing a silver powder having a central particle diameter D50 of from 0.5 μm to 5 μm (inclusive) and preferably having a tap density of 2.0 g/cm3 or more, a binder resin containing 60% by weight or more of a phenoxy resin having a number average molecular weight of 3,000 to 100,000 and an acid value of 20 eq./106 to 500 eq./106, a solvent and a dispersant that is preferably in a solid state at 25°C or higher, the resulting dispersion mixture is filtered, thereby obtaining a conductive paste which has a degree of dispersity of 10 μm or less as determined with a grind gage as specified by ISO 1524 (2013). According to the present invention, a thin wiring line is obtained by applying the thus-obtained conductive paste to a device material, on which an inorganic thin film has been formed, and subsequently drying and curing the conductive paste and then subjecting the resulting conductive paste to laser etching.
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