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ADDITIVE MANUFACTURING EQUIPMENT UTILIZING COMBINED ELECTRON BEAM SELECTIVE MELTING AND ELECTRON BEAM BUTTING
ADDITIVE MANUFACTURING EQUIPMENT UTILIZING COMBINED ELECTRON BEAM SELECTIVE MELTING AND ELECTRON BEAM BUTTING
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机译:利用电子束选择性熔化和电子束结合的增材制造设备
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摘要
Additive manufacturing equipment utilizing combined electron beam selective melting and electron beam butting. The additive manufacturing equipment comprises an electron beam emitting, focusing, and scanning device (6) capable of emitting electronic beams (67, 68) for use in a heating mode, a selective melting mode, or an electronic beam cutting mode. In the heating mode, the electron beam emitting, focusing, and scanning device (6) emits an electronic beam to scan and preheat a powder bed (7). In the selective melting mode, the electron beam emitting, focusing, and scanning device (6) emits the electronic beam (67) to scan and melt powders (71) in a cross-sectional outline to form a required component cross-sectional layer. In the electronic beam cutting mode, the electron beam emitting, focusing, and scanning device (6) emits the electronic beam (68) to perform one or more cutting scans on inner and outer outlines (74, 75) of a component cross-section to obtain accurate and smooth inner and outer outlines of the component cross-section. The electron beam emitting, focusing, and scanning device (6) is further configured to repeat the heating, selective melting, or electronic beam cutting processes to obtain a required three-dimensional physical component.
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