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ADDITIVE MANUFACTURING EQUIPMENT UTILIZING COMBINED ELECTRON BEAM SELECTIVE MELTING AND ELECTRON BEAM BUTTING

机译:利用电子束选择性熔化和电子束结合的增材制造设备

摘要

Additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam butting. The additive manufacturing apparatus comprises an electron beam emitting, focusing, and scanning device (6) capable of emitting electron beams (67, 68) for use in a heating mode, a selective melting mode, or an electron beam cutting mode. In the heating mode, the electron beam emitting, focusing, and scanning device (6) emits an electron beam to scan and preheat a powder bed (7). In the selective melting mode, the electron beam emitting, focusing, and scanning device (6) emits the electron beam (67) to scan and melt powder (71) in a cross-sectional outline to form a required component cross-sectional layer. In the electron beam cutting mode, the electron beam emitting, focusing, and scanning device (6) emits the electron beam (68) to perform one or more cutting scans on inner and outer outlines (74, 75) of a component cross-section to obtain accurate and smooth inner and outer outlines of the component cross-section. The electron beam emitting, focusing, and scanning device (6) is further configured to repeat the heating, selective melting, or electron beam cutting processes to obtain a required three-dimensional physical component.
机译:利用组合的电子束选择性熔化和电子束对接的增材制造设备。增材制造设备包括能够发射用于加热模式,选择性熔化模式或电子束切割模式的电子束(67、68)的电子束发射,聚焦和扫描装置(6)。在加热模式下,电子束发射,聚焦和扫描装置(6)发射电子束以扫描并预热粉末床(7)。在选择熔化模式中,电子束发射,聚焦和扫描装置(6)发射电子束(67)以扫描和熔化横截面轮廓中的粉末(71),以形成所需的部件横截面层。在电子束切割模式中,电子束发射,聚焦和扫描装置(6)发射电子束(68),以对组件横截面的内部和外部轮廓(74、75)进行一次或多次切割扫描以获得准确,平滑的组件横截面的内部和外部轮廓。电子束发射,聚焦和扫描装置(6)还被配置为重复加热,选择性熔化或电子束切割过程,以获得所需的三维物理成分。

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