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ADDITIVE MANUFACTURING EQUIPMENT UTILIZING COMBINED ELECTRON BEAM SELECTIVE MELTING AND ELECTRON BEAM BUTTING
ADDITIVE MANUFACTURING EQUIPMENT UTILIZING COMBINED ELECTRON BEAM SELECTIVE MELTING AND ELECTRON BEAM BUTTING
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机译:利用电子束选择性熔化和电子束结合的增材制造设备
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摘要
Additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam butting. The additive manufacturing apparatus comprises an electron beam emitting, focusing, and scanning device (6) capable of emitting electron beams (67, 68) for use in a heating mode, a selective melting mode, or an electron beam cutting mode. In the heating mode, the electron beam emitting, focusing, and scanning device (6) emits an electron beam to scan and preheat a powder bed (7). In the selective melting mode, the electron beam emitting, focusing, and scanning device (6) emits the electron beam (67) to scan and melt powder (71) in a cross-sectional outline to form a required component cross-sectional layer. In the electron beam cutting mode, the electron beam emitting, focusing, and scanning device (6) emits the electron beam (68) to perform one or more cutting scans on inner and outer outlines (74, 75) of a component cross-section to obtain accurate and smooth inner and outer outlines of the component cross-section. The electron beam emitting, focusing, and scanning device (6) is further configured to repeat the heating, selective melting, or electron beam cutting processes to obtain a required three-dimensional physical component.
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