DISPERSION, METHOD FOR PRODUCING CONDUCTIVE PATTERN-EQUIPPED STRUCTURE BY USING DISPERSION, AND CONDUCTIVE PATTERN-EQUIPPED STRUCTURE

摘要

The present invention forms a conductive pattern which exhibits low resistance on a substrate, and also exhibits high dispersion stability. A dispersion (1) including a copper oxide (2), a dispersion agent (3), and a reducing agent, wherein the reducing agent content falls within the range specified by formula (1), and the dispersion agent content falls within the range specified by formula (2). (1): 0.0001≤(reducing agent mass/copper oxide mass)≤0.10. (2): 0.0050≤(dispersion agent mass/copper oxide mass)≤0.30. Copper sintering is accelerated by promoting the reduction of copper oxide to copper during firing by inclusion of the reducing agent.