SILICON CHIP HOLDING DEVICE, SILICON CHIP CONVEYING DEVICE, SILICON CHIP DELIVERY SYSTEM AND CONVEYING METHOD

摘要

Provided are a silicon chip holding device (1), a silicon chip conveying device, a silicon chip delivery system and a conveying method. The silicon chip holding device (1) is installed at the silicon chip conveying device. The silicon chip holding device (1) comprises a holding device main body (11) and a chuck device (12). The holding device main body has a first opening (111). The chuck device comprises a first skirt structure (121) positioned at one side of the holding device main body and connected to the first opening. A groove structure (112) is arranged at where the first skirt structure is connected to the first opening. The groove structure (112) is positioned at an outer side of the first skirt structure. Arrangement of a groove structure at an outer side of the first skirt structure (121) where the first skirt structure is connected to the first opening can release stress applied to a root portion of the chuck device due to deformation of the first skirt structure.