IRON-NICKEL ALLOY ELECTROPLATING LIQUID FOR FILLING AND METHOD FOR FILLING OPENING USING SAME, AND METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE

摘要

Provided are: an iron-nickel alloy electroplating liquid for filling, characterized in that an acetylene alcohol is furthermore contained in the iron-nickel alloy electroplating liquid; a method for filling an opening using the iron-nickel alloy electroplating liquid for filling; and a technique whereby an iron-nickel alloy can be utilized in circuit formation by electroplating using a method for manufacturing a circuit substrate.