The present invention provides a copper particle mixture and a method for manufacturing the same, a copper particle mixture dispersion in which the copper particle mixture is dispersed, and an ink containing the copper particle mixture, the ink containing the copper particle mixture dispersion, the copper particle mixture whereby oxidation of the copper is suppressed, and the copper particle mixture has high dispersibility and can be sintered at low temperature in a short time in a reducing atmosphere or a non-reducing atmosphere. The present invention is a copper particle mixture including copper fine particles A and copper nanoparticles B, the copper particle mixture being characterized in that the copper fine particles A have an average particle diameter of 0.1 µm to 5 µm and are coated by at least one species of dicarboxylic acid selected from the group consisting of malonic acid and oxalic acid, the copper nanoparticles B comprise a center part comprising a copper single crystal and a protective layer on the periphery of the center part, the average particle diameter of the copper nanoparticles B is 1 nm to less than 100 nm, and the protective layer of the copper nanoparticles B includes at least one species selected from the group consisting of a C3-6 primary alcohol, a C3-6 secondary alcohol, and a derivative thereof.
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