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- - - ON-DIE TERMINATION CIRCUIT DATA OUTPUT BUFFER SEMICONDUCTOR MEMORY DEVICE MEMORY MODULE METHOD OF OPERATING AN ON-DIE TERMINATION CIRCUIT METHOD OF OPERATING A DATA OUTPUT BUFFER AND METHOD OF TRAINING ON-DIE TERMINATION
- - - ON-DIE TERMINATION CIRCUIT DATA OUTPUT BUFFER SEMICONDUCTOR MEMORY DEVICE MEMORY MODULE METHOD OF OPERATING AN ON-DIE TERMINATION CIRCUIT METHOD OF OPERATING A DATA OUTPUT BUFFER AND METHOD OF TRAINING ON-DIE TERMINATION
The on-die termination circuit of the semiconductor memory device includes a termination resistance portion and a switching control portion. The termination resistor portion is connected to the external pin and provides a termination resistance to the transmission line connected to the external pin. The switching control section is connected to the terminal resistance section and adjusts the resistance value of the terminal resistance in response to the asynchronous control signal not synchronized with the external clock signal. The on-die termination circuit may be controlled asynchronously to reduce power consumption by turning off the clock synchronization circuit.
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