METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES

摘要

The electroplating process enables plating of photoresist defined features having a substantially uniform shape. Electroplating methods include copper electroplating baths containing reaction products of alpha -amino acid and bisepoxide to electroplate electroplated resist features. These features include columns, bond pads, and line space features.