Burn-in test socket having wire silicon rubber interposed between contact pin and semiconductor device

摘要

A burn-in test socket of the present invention comprises a base coupled to a test apparatus, a pin plate mounted on the base and accommodating a plurality of pairs of resilient nipper-type contact pins, A wire silicone rubber connected to a connection terminal of the semiconductor device through the upper bump, a guide for fixing the wire silicone rubber to the base while guiding the semiconductor device at an upper portion thereof and a guide for guiding the semiconductor device at a lower portion thereof, And a cover provided on the base on the guide and providing a driving force of the latch. According to the structure of the present invention as described above, the contact characteristics are improved even though the circuit line width tends to be small.