DMD INTEGRATED MICRO-CHANNEL HEATSINK IN DMD SUBSTRATE FOR ENHANCED COOLING CAPACITY

摘要

A DMD cooling apparatus and method include a DMD chip configured on a substrate, and a heatsink located within and integrated into the substrate upon which the DMD is configured. A plurality of micro-channels can be formed on a backside of the substrate. The micro-channels are fabricated via microlithography in association with a fabrication of the DMD chip such that the heatsink integrated into the silicon substrate allows for direct heat removal from the substrate.