WIPO Patent Application WO / 2006/055695 A waded laminate film, a substrate-processed body using a wearable laminate film, a method of manufacturing a laminated board-processed body, and a method of manufacturing a semiconductor device using the waded laminated film

摘要

An object of the present invention is to provide a semiconductor device which is excellent in heat resistance and can be formed as a film to a peripheral portion of a substrate and can adhere the semiconductor circuit formation substrate and the support substrate or the support film layer with one kind of adhesive, The present invention provides a wear-resistant laminate film comprising the same. The present invention relates to a siloxane polymer having at least three layers of a protective film layer (A), an adhesive layer (B), and a support film layer (C), and at least the adhesive layer (B) Is a wear-resistant laminate film containing a compound represented by the following formula (1).