首页> 外国专利> CALIBRATION CURVE DETERMINATION METHOD CARBON CONCENTRATION MEASUREMENT METHOD AND SILICON WAFER-MANUFACTURING METHOD

CALIBRATION CURVE DETERMINATION METHOD CARBON CONCENTRATION MEASUREMENT METHOD AND SILICON WAFER-MANUFACTURING METHOD

机译:校准曲线测定法碳浓度测定法和硅晶片制造法

摘要

An object of the present invention is to measure a carbon concentration with a small number of calibration curves for silicon wafers containing oxygen at a high concentration. A calibration curve determination method includes: a step (S11) of providing a plurality of wafer groups each including a plurality of silicon wafers having the same oxygen concentration and different carbon concentrations, the wafer groups being different from each other in the oxygen concentration of the silicon wafers included therein; a step (S12) of irradiating a plurality of regions of each of the silicon wafers with electron beams at different irradiation doses; a step (S13) of obtaining, by a photoluminescence (PL) method, an intensity ratio of a first luminescence intensity deriving from silicon to a second luminescence intensity deriving from carbon for each of the regions; a step (S14) of classifying obtained data into a plurality of data sets and creating a first calibration curve for each data set, the data included in each of the data sets having the same irradiation dose and the same oxygen concentration, and the data sets being different from each other in at least one of the irradiation dose and the oxygen concentration; a step (S15) of selecting a pair of the first calibration curves which are equal to each other in the irradiation dose and different from each other in the oxygen concentration, and obtaining a difference between slopes of the paired first calibration curves on a log-log plot; and a step (S16) of creating a second calibration curve using all of the data contained in the data set used for creating the selected first calibration curve.
机译:本发明的目的是用少量的校准曲线对含有高浓度氧的硅晶片测量碳浓度。校准曲线确定方法包括:步骤(S11),提供多个晶片组,每个晶片组包括具有相同氧浓度和不同碳浓度的多个硅晶片,晶片组的氧浓度彼此不同。其中包括的硅晶片;步骤(S12),将电子束以不同的照射剂量照射到每个硅晶片的多个区域;步骤(S13),通过光致发光(PL)方法,获得每个区域的源自硅的第一发光强度与源自碳的第二发光强度的强度比;步骤(S14),将获得的数据分类为多个数据集,并为每个数据集创建第一校准曲线,每个数据集中包括的数据具有相同的辐照剂量和相同的氧气浓度,以及所述数据集照射剂量和氧浓度中的至少一者彼此不同。步骤(S15),选择在辐射剂量上彼此相等但在氧气浓度上彼此不同的一对第一校准曲线,并在对数-上获得成对的第一校准曲线的斜率之间的差。对数图;步骤(S16),使用包含在用于创建所选择的第一校准曲线的数据集中的所有数据来创建第二校准曲线。

著录项

  • 公开/公告号KR20180092811A

    专利类型

  • 公开/公告日2018-08-20

    原文格式PDF

  • 申请/专利权人 GLOBALWAFERS JAPAN CO. LTD.;

    申请/专利号KR20170179436

  • 发明设计人 NAKAGAWA SATOKO;NAGAI YUTA;

    申请日2017-12-26

  • 分类号G01N21/95;G01N22/02;

  • 国家 KR

  • 入库时间 2022-08-21 12:39:16

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