NEW ORGANOSILICON COMPOUND THERMOSETTING RESIN COMPOSITION CONTAINING THE ORGANOSILICON COMPOUND HARDENING RESIN AND ENCAPSULATION MATERIAL FOR OPTICAL SEMICONDUCTOR

摘要

The present invention provides a silicone resin-based thermosetting resin composition capable of obtaining a cured product having a high refractive index and good heat resistance.A liquid organosilicon compound represented by the following general formula (1). Here, X is independently a group represented by the following formula (I), (II) or (III) and is a group represented by the formula (1) per molecule of the liquid organosilicon compound [ When the compound is a mixture of a compound represented by the formula (I) and a compound represented by the formula (II) and a compound represented by the formula (III) (A), the number of groups represented by the formula (II) is b, and the number of groups represented by the formula (III) is c, 0 A 3.5, 0 B 3.5, c 1, and a + b + 2c = 4. R^OneEach independently represent a group selected from alkyl having 1 to 4 carbon atoms, cyclopentyl and cyclohexyl, R²And R³Each independently represent a group selected from alkyl having 1 to 4 carbon atoms, cyclopentyl, cyclohexyl and phenyl, m and n are-OSi (R³)₂-, and is an average value satisfying 1 to 50.