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METHOD OF GLASS CERAMIC SUBSTRATES CLEANING IN THE LOW PRESSURE HIGH-FREQUENCY PLASMA JET

机译:低压高频等离子体射流中玻璃陶瓷基体的清洁方法

摘要

FIELD: technological processes.;SUBSTANCE: invention relates to the glass ceramics substrates cleaning method. Method includes chemical purification and washing in deionized water. After washing in deionized water, the prefabricated glass ceramics substrate is preheated in the high-frequency plasma jet at a distance of 60 to 120 mm from the high-frequency plasmatron cutoff for 1 min to 2 min with the HF generator power from 1,400 W to 1,500 W by changing the process gas flow rate from 0.04 g/s to 0.06 g/s. Then, carrying out the glass ceramics substrates cleaning in a high-frequency plasma jet is for 5 minutes to 10 minutes at a high-frequency generator power from 1,500 W to 1,750 W, plasma forming gas consumption from 0.06 to 0.08 g/s, pressure from 19.0 to 26.6 Pa, followed by a smooth decrease in gas flow rate from 0.06 g/s to 0.04 g/s for 1 minute up to 2 min.;EFFECT: method provides obtaining of the glass ceramic substrates clean hydrophilic surface without contamination in the form of separate particles or as a film.;4 cl, 1 tbl
机译:玻璃陶瓷基板的清洁方法技术领域本发明涉及一种玻璃陶瓷基板的清洁方法。方法包括化学纯化和在去离子水中洗涤。用去离子水洗涤后,将预制的玻璃陶瓷基板在高频等离子体射流中与高频等离子加速器截止点相距60至120 mm的距离预热1分钟至2分钟,HF发生器的功率为1,400 W至通过将工艺气体流速从0.04 g / s更改为0.06 g / s,可达到1,500W。然后,以1,500W至1,750W的高频发生器功率,以高频等离子流对玻璃陶瓷基板进行5分钟至10分钟的清洁,等离子形成气体的消耗量为0.06至0.08g / s,压力从19.0 Pa降低到26.6 Pa,然后气体流速从0.06 g / s平稳降低到0.04 g / s,持续1分钟到2分钟;效果:该方法可提供玻璃陶瓷基板清洁的亲水性表面,而不会污染单独的颗粒形式或薄膜形式; 4 cl,1 tbl

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