Device for heat insulation for an LED lamp, LED lamp with it and manufacturing process for it as well as Modular LED lamp

摘要

A thermal insulation device (200; 300) for an LED lamp (500), said thermal insulation device (200; 300) comprising: a first surface (202, 302) configured to be proximate to an LED assembly (508) of the LED lamp (500) and a second surface (204, 304) configured to be proximate to a power supply (100 ) of the lamp (500); and Contact means (208, 212, 308) formed on the first surface (202, 302) and on the second surface (204, 304) for maintaining a heat transfer gap (540) between the power supply (100) and the second surface (16). 204, 304) of the thermal insulation device (200; 300) and another heat transfer gap (542) between the LED assembly (508) and the first surface (202, 302) of the thermal insulation device (200; wherein at least some of the contact means (208, 212, 308) comprise a plurality of triangular ridges (212) and a plurality of conical projections (308) disposed on at least one of the first and second surfaces (202, 204, 302, 304). are distributed by the device for thermal insulation (200, 300), and wherein the heat transfer gap (540) between the power supply (100) and the second surface (204, 304) of the thermal insulation device (200; 300) has a height of between 0.1mm to 5mm.