Method for arranging a number of micromechanical acceleration sensors on or in a plastic component and corresponding plastic component

摘要

The invention relates to a method for arranging a number of micromechanical acceleration sensors on or in a plastic component, in particular a bumper, and to a corresponding plastic component, in particular a bumper. In step A of the method, the micromechanical acceleration sensor is positioned in or on a flexible circuit carrier in a fixed manner, and the micromechanical acceleration sensor is contacted with an integrated conductor track structure of the flexible circuit carrier. In step B of the method, at least some regions of the micromechanical acceleration sensor and the flexible circuit carrier are arranged on or in the plastic component such that the integrated conductor track structure of the flexible circuit carrier is at least partly exposed.