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Via etch method for back contact multijunction solar cells
Via etch method for back contact multijunction solar cells
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机译:用于背接触多结太阳能电池的通孔蚀刻方法
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摘要
This disclosure relates to semiconductor devices and methods for fabricating semiconductor devices. Particularly, the disclosure relates to back-contact-only multijunction solar cells and the process flows for making such solar cells, including a wet etch process that removes semiconductor materials non-selectively without major differences in etch rates between heteroepitaxial III-V semiconductor layers.
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