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A CONNECTION PIN FOR MOUNTING IN A COMPONENT CARRIER, A METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY COMPRISING A MOTHERBOARD WITH STACKABLE MODULES COMPRISING A COMPONENT CARRIER, AND SUCH AN ELECTRONIC ASSEMBLY
A CONNECTION PIN FOR MOUNTING IN A COMPONENT CARRIER, A METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY COMPRISING A MOTHERBOARD WITH STACKABLE MODULES COMPRISING A COMPONENT CARRIER, AND SUCH AN ELECTRONIC ASSEMBLY
A connection pin for mounting in a through-hole provided in a component carrier of an electronic assembly, the connection pin comprising an anchoring part adapted for insertion into said through-hole, a contact part adapted to extend outside said through-hole, and a flange part adapted to abut against said component carrier and located between said anchoring part and said contact part. The connection pin is provided with an internal cavity, which is provided with an outer opening at a free end of the anchoring part. The contact part is provided with a protruding elongated interconnection member at a free end thereof, and the respective shapes of the interconnection member and the internal cavity are such that the interconnection member is adapted for insertion into a corresponding internal cavity of another similar connection pin. A method for producing an electronic assembly with stackable modules is also disclosed.
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