METHOD FOR SEAMLESSLY COUPLING FABRIC USING BONDING PATTERN LINE FORMED BY HIGH-FREQUENCY BONDING TECHNIQUE

摘要

The present invention can combine fabrics in a seamless manner by forming at least one bonding pattern line by a process comprising: printing and drying a heat-reactive adhesive on the inner surface of an inner fabric, and/or an outer fabric or an optional mesh material in a predetermined pattern, laminating said inner fabric, optional reinforced material and outer fabric, and then high-frequency heating them under pressing with a pressing pattern the same as the printing pattern to bond the inner fabric, and outer fabric. Since the present invention combines fabrics by employing a high-frequency bonding manner in which a heat-reactive adhesive is used, it is possible to combine fabrics in a seamless manner with a bonding pattern line which is composed of a bonding line with excellent adhesiveness and durability and an aesthetically excellent pattern line with a good clearness and finishing quality.