SOLDER RESIST FOR APPLYING USING INKJET TECHNOLOGY

摘要

The invention relates to a solder resist for application by ink jet technology, wherein the composition of the solder resist has a heat resistance for an ink jet system.;In order to specify a solder resist with which cost-effective and resource-saving even finer structures, in part of 50 μm, can be realized, the composition should comprise at least the following components: at least one monomer having at least one cationically curable group and / or at least one oligomer having at least one cationically curable group, at least one monomer having at least one free-radically curable group and / or at least one oligomer having at least one free-radically curable group, at least one monomer having at least one thermally curable group and / or at least one oligomer having at least one thermally curable group, at least one free-radically initiating photopolymerization initiator and at least one cationically initiating photopolymerization initiator.