DEVICE FOR PROCESS MONITORING IN A DEPOSITION WELDING METHOD

摘要

The invention relates to a device and a method for process monitoring in a deposition welding method. The object of the invention is to provide a device in which the process monitoring in a deposition welding method is further optimized, and process deviations that can affect the quality of a product are reliably avoided. Surprisingly, the devices known in the state of the art for process monitoring in deposition welding can be developed to a substantially optimized process monitoring, in which said devices are supplemented by equipment for detecting a time period during which the detected surface region is greater than a predetermined minimum value, and equipment for discontinuing the deposition welding process in an automated manner in the event that the time period of the detected surface region is greater than a predetermined time value.