PRE-ALIGNMENT APPARATUS AND PRE-ALIGNMENT METHOD

摘要

To provide a pre-alignment apparatus and a pre-alignment method capable of transporting and pre-aligning a wafer without destroying an electronic device provided on the wafer.SOLUTION: A pre-alignment apparatus includes: chuck means 52; lift means 58 that is provided so as to be movable up and down with respect to the chuck means 52, receives and supporting a lower surface of a wafer W, and moves the wafer W to the chuck means 52; centering means 60 that centers the wafer W supported by the lift means 58; and suction means 64 that sucks nd holds an outer periphery of the lower surface of the wafer W after the wafer W supported by the lift means 58 is moved to the chuck means 52 and the lower surface of the wafer W is placed on the chuck means 52.SELECTED DRAWING: Figure 4