RESIN COMPOSITION FOR TRANSFER MOLDING, ELECTRIC AND ELECTRONIC DEVICE HAVING MOLDED ARTICLE OF THE RESIN COMPOSITION, AND MANUFACTURING METHOD OF MOLDED ARTICLE USING THE RESIN COMPOSITION

摘要

To provide a resin composition good in moldability and containing a magnetic particle.SOLUTION: There is provided a resin composition for transfer molding containing a magnetic particle and a resin, and having Tof 50 to 250 kgf cm, and Tof 100 to 300 kgf cm, wherein Tis a curing torque at 300 sec. after measurement initiation and Tis a curing torque at 500 sec. after the measurement initiation when the curing torque is measured of the resin composition at measurement temperature of 175°C by using a curastometer.SELECTED DRAWING: Figure 1