SUBSTRATE PROCESSING APPARATUS AND METHOD OF CONTROLLING THE SAME, FILM DEPOSITION APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

摘要

To provide a technique capable of efficiency performing surface processing on a surface of a substrate.SOLUTION: A substrate processing apparatus has: support means which supports a substrate; a first ion source and a second ion source which are arranged in such position relation that the substrate is sandwiched; and control means which performs control to irradiate processing surfaces on both sides of the one substrate or respective processing surfaces of two substrates with ion beams from the first and second ion sources while moving one substrate supported by the support means or the two substrates supported by the support means to have opposite surfaces from the respective processing surfaces opposed to each other, and the first and second ion sources relatively in a first direction along the surfaces of the substrates.SELECTED DRAWING: Figure 1